Ground Bonding

  1. TIA-607-D (Latest Revision)

    The latest TIA Standard for Telecommunications Bonding and Grounding (TIA-607-D) was released in July 2019. After a quick review there appears to be only a few revisions to the standard as it relates to bonding components and design requirements for telecommunications equipment ground bonding. Following are some areas where minor revisions were made: 6.3.5 Sizing the Secondary Bonding Conductor (SBC...

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