The latest TIA Standard for Telecommunications Bonding and Grounding (TIA-607-D) was released in July 2019. After a quick review there appears to be only a few revisions to the standard as it relates to bonding components and design requirements for telecommunications equipment ground bonding.

Following are some areas where minor revisions were made:

6.3.5 Sizing the Secondary Bonding Conductor (SBC)
The minimum SBC size shall be the greater of 6 AWG or the largest conductor bonded to the associated SBB (Secondary Bonding Busbar). See 7.3.2

7.1 General
Grounding through the equipment alternating current (ac) power cord does not meet the intent of this standard. It is intended that the information technology equipment (ITE) be provided a supplementary and specific ground path for the equipment over and above the required ac or direct current (dc) power ground path. While the ac powered equipment typically has a power cord that contains a grounding/bonding wire, the integrity of this path to ground cannot be easily verified. Rather than relying wholly on the power cord grounding/bonding wire, it is desirable that equipment be grounded in a verifiable "supplementary" manner as described in this Standard.

7.1.5 Metallic Pathways
Note - The bonding of cable tray sections can be accomplished with the use of approved mechanical bonds (e.g., the bolting of sections together).

7.3.2 Bonding to the TBB
The TBB (Telecommunications Bonding Backbone) may be bonded directly to the SBB. Alternately, an SBC may be used between the two. The SBC shall be continuous and routed in the shortest practical straight-line path.

If you have any questions about busbars or bonding conductors, give me a call and we can discuss what you need.

Full TIA-607-C Standard